Title :
Multi-physics modelling of thin films: Optimization for finite elements simulations tools
Author :
Youssef, Toni ; Woirgard, Eric ; Azzopardi, Stephane ; Martineau, Donatien ; Meuret, Regis
Author_Institution :
IMS Lab., Univ. of Bordeaux, Talence, France
Abstract :
This paper focuses on the thin Nickel layer thicknesses. Thermal and mechanical behaviors of these thin layers in a power module are investigated. An approach is shown in order to present an improved modeling by considering the effect of these thin layers and by reducing time computation.
Keywords :
cracks; finite element analysis; metallic thin films; nickel; optimisation; shear strength; thermal analysis; Ni; cracks; finite element simulations; mechanical behaviors; multiphysics modelling; optimization; power module; shear strength; thermal analysis; thin films; Computational modeling; Heating; Metallization; Nanoscale devices; Nickel; Optimization; Substrates;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on
Conference_Location :
Budapest
Print_ISBN :
978-1-4799-9949-1
DOI :
10.1109/EuroSimE.2015.7103138
