DocumentCode :
708409
Title :
Compact power module for integrated traction inverters with highest power density
Author :
Muhlfeld, Ole ; Olesen, Klaus ; Paulsen, Lars ; Bredtmann, Rudiger
Author_Institution :
Danfoss Silicon Power GmbH, Flensburg, Germany
fYear :
2015
fDate :
15-19 March 2015
Firstpage :
2420
Lastpage :
2423
Abstract :
In Hybrid and Electric Vehicle (xEV) traction inverters the ongoing trend for mating power electronic components with mechanical assemblies (i.e. in the powertrain with combustion engine or gear-box) must be supported by the development of compact and robust power modules offering highest power densities. This paper presents a new concept for a compact and direct liquid cooled power module for automotive traction applications. The power module is comprised of a newly developed high performance liquid cooling system that is combined with advanced sintering die attach and copper-wire-bonding technology being encapsulated in a transfer-molded package in order to live up to stringent requirements of automotive traction inverter designs to come. Prototypes of this module were manufactured and tested to confirm their electrical, thermal and lifetime characteristics and have proven their flexibility and performance.
Keywords :
automotive engineering; cooling; electronics packaging; encapsulation; hybrid electric vehicles; invertors; microassembling; sintering; traction; transfer moulding; automotive traction application; combustion engine; copper-wirebonding technology; die attach; encapsulation; gear-box; hybrid and electric vehicle traction inverter; liquid cooled power module system; mechanical assemblies; power density; power electronic components; powertrain; sintering; transfer-molded packaging; xEV traction inverter; Cooling; Insulated gate bipolar transistors; Inverters; Multichip modules; Robustness; Switches; Temperature measurement; integration; power module; traction inverter;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applied Power Electronics Conference and Exposition (APEC), 2015 IEEE
Conference_Location :
Charlotte, NC
Type :
conf
DOI :
10.1109/APEC.2015.7104687
Filename :
7104687
Link To Document :
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