• DocumentCode
    708540
  • Title

    Accelerated degradation testing of coating of PCB under humid heat env

  • Author

    Xiaoming Ren ; Xiaohui Wang ; Run Zhu

  • Author_Institution
    Sch. of Reliability & Syst. Eng., Beihang Univ., Beijing, China
  • fYear
    2015
  • fDate
    26-29 Jan. 2015
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Printed circuit board (PCB) is the carrier of electronic components. Its coating is the first barrier for protecting itself. If the coating is damaged, the performance of printed circuit board will decrease rapidly until failure. Therefore, the coating plays an important role to the entire printed circuit board. In this paper, we designed an accelerated degradation test under humid heat environment for a typical kind of coating (Parylene C). And chose insulation resistance, moisture absorption and surface morphology as its test indexes. At last, we estimate the coating´s failure time based on the degradation of insulation resistance.
  • Keywords
    coatings; humidity; life testing; moisture; printed circuit manufacture; surface morphology; PCB coating; Parylene C coating; accelerated degradation testing; coating failure time; electronic components; humid heat environment; insulation resistance; moisture absorption; printed circuit board; surface morphology; Coatings; Degradation; Fitting; Insulation; Life estimation; Reliability; Stress; Accelerated degradation testing; Parylene C; failure time; humid heat environment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability and Maintainability Symposium (RAMS), 2015 Annual
  • Conference_Location
    Palm Harbor, FL
  • Print_ISBN
    978-1-4799-6702-5
  • Type

    conf

  • DOI
    10.1109/RAMS.2015.7105094
  • Filename
    7105094