DocumentCode
708540
Title
Accelerated degradation testing of coating of PCB under humid heat env
Author
Xiaoming Ren ; Xiaohui Wang ; Run Zhu
Author_Institution
Sch. of Reliability & Syst. Eng., Beihang Univ., Beijing, China
fYear
2015
fDate
26-29 Jan. 2015
Firstpage
1
Lastpage
5
Abstract
Printed circuit board (PCB) is the carrier of electronic components. Its coating is the first barrier for protecting itself. If the coating is damaged, the performance of printed circuit board will decrease rapidly until failure. Therefore, the coating plays an important role to the entire printed circuit board. In this paper, we designed an accelerated degradation test under humid heat environment for a typical kind of coating (Parylene C). And chose insulation resistance, moisture absorption and surface morphology as its test indexes. At last, we estimate the coating´s failure time based on the degradation of insulation resistance.
Keywords
coatings; humidity; life testing; moisture; printed circuit manufacture; surface morphology; PCB coating; Parylene C coating; accelerated degradation testing; coating failure time; electronic components; humid heat environment; insulation resistance; moisture absorption; printed circuit board; surface morphology; Coatings; Degradation; Fitting; Insulation; Life estimation; Reliability; Stress; Accelerated degradation testing; Parylene C; failure time; humid heat environment;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability and Maintainability Symposium (RAMS), 2015 Annual
Conference_Location
Palm Harbor, FL
Print_ISBN
978-1-4799-6702-5
Type
conf
DOI
10.1109/RAMS.2015.7105094
Filename
7105094
Link To Document