Title :
Measurement and modeling of IC self-heating including cooling system properties
Author :
Nishimura, T. ; Tanoue, H. ; Oodate, Y. ; Mattausch, H.J. ; Miura-Mattausch, M.
Author_Institution :
Grad. Sch. of Adv. Sci. of Matter, Hiroshima Univ., Higashi-Hiroshima, Japan
Abstract :
Heating and cooling mechanisms under actual IC-operating conditions are investigated experimentally and theoretically. For the investigation different chip packages and cooling-system approaches are studied. Comparison between experimental and theoretical studies concludes that the optimum possible package design is obtained by enhancing both the heat radiation and the air convection at the same time.
Keywords :
cooling; heating; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; IC self-heating measurement; IC self-heating modeling; air convection; chip packages; package design; Atmospheric modeling; Cooling; Heating; Length measurement; Mathematical model; Power measurement; Thermal resistance;
Conference_Titel :
Microelectronic Test Structures (ICMTS), 2015 International Conference on
Conference_Location :
Tempe, AZ
Print_ISBN :
978-1-4799-8302-5
DOI :
10.1109/ICMTS.2015.7106115
