DocumentCode
709046
Title
Robust and efficient RLGC extraction for transmission line structures with periodic three-dimensional geometries
Author
Yunhui Chu ; Yu, Jason Zhenwei ; Zhiguo Qian
Author_Institution
Intel Corp., USA
fYear
2015
fDate
15-21 March 2015
Firstpage
203
Lastpage
208
Abstract
A general method is proposed to extract frequency dependent RLGC model from simulated S-parameters for multi-conductor transmission line structures with periodic three-dimensional geometries. It is demonstrated to be robust for both short and long structures and various geometries, and highly efficient for structures with a large number of lines. The method has been tested for transmission line systems with up to 100 lines, which has not been seen in literature. A mode tracking technique is employed to obtain the unique solution for the propagation constant matrix. Equivalent lumped circuit networks are used to ensure extraction accuracy at low frequencies down to DC and provide seamless transition to the general formulation as frequency increases. The Kramers-Kronig relation is applied for causality enforcement and extraction of inductance and capacitance values at infinite frequency.
Keywords
Kramers-Kronig relations; RLC circuits; S-parameters; electric admittance; equivalent circuits; lumped parameter networks; microstrip lines; multiconductor transmission lines; Kramers-Kronig relation; capacitance extraction; causality enforcement; efficient RLGC extraction; equivalent lumped circuit network; frequency dependent RLGC model; inductance extraction; mode tracking technique; multiconductor transmission line structure; periodic three dimensional geometries; propagation constant matrix; robust RLGC extraction; simulated S-parameters; Crosstalk; Geometry; Mathematical model; Matrix converters; Power transmission lines; Scattering parameters; Transmission line matrix methods; RLGC; S-parameters; W-element; per-unit-length parameters; periodically loaded transmission line; transmission line;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility and Signal Integrity, 2015 IEEE Symposium on
Conference_Location
Santa Clara, CA
Print_ISBN
978-1-4799-1992-5
Type
conf
DOI
10.1109/EMCSI.2015.7107686
Filename
7107686
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