Title :
Near-field coupling estimation by source reconstruction and Huygens´s equivalence principle
Author :
Liang Li ; Jingnan Pan ; Chulsoon Hwang ; Gyuyeong Cho ; Harkbyeong Park ; Yaojiang Zhang ; Jun Fan
Author_Institution :
EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
Abstract :
This study is to estimate the near-field coupling in mixed digital/RF circuit design for modern high speed electronic systems. The noise source IC is first modelled by physics-based dipole moment model with data obtained from a near-field scanning plane. The victim RF antenna is modelled in full-wave simulation tool and the noise IC is further modelled as Huygens´s equivalent source. The tangential fields on the Huygens´s box can be calculated by dipole moment model with negligible multiple scattering effect assumption. The noise coupling then can be obtained by surface integration of Poynting vector at the RF antenna receiving port. A full-wave simulation model is first studied to demonstrate the method and a noisy clock buffer IC with victim patch antenna is measured for further validation.
Keywords :
electric moments; electromagnetic wave scattering; microstrip antennas; mixed analogue-digital integrated circuits; radiofrequency integrated circuits; signal reconstruction; Huygens box; Huygens equivalence principle; Huygens equivalent source; Poynting vector; clock buffer; dipole moment; full-wave simulation tool; high speed electronic systems; mixed digital-radiofrequency circuit design; multiple scattering effect; near-field coupling estimation; near-field scanning plane; noise coupling; noise source; patch antenna; radiofrequency antenna; source reconstruction; surface integration; tangential fields; Analytical models; Couplings; Integrated circuit modeling; Magnetic moments; Noise; Patch antennas; Huygens´s equivalence principa; Radio-frequency interference; digital/RF circuit design; dipole-moment model; near-field coupling; near-field scanning;
Conference_Titel :
Electromagnetic Compatibility and Signal Integrity, 2015 IEEE Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4799-1992-5
DOI :
10.1109/EMCSI.2015.7107708