DocumentCode :
709057
Title :
Efficient multidimensional statistical modeling of high speed interconnects in SPICE via stochastic collocation using stroud cubature
Author :
Ahadi, Majid ; Vempa, Mounica ; Roy, Sourajeet
Author_Institution :
Dept. of Electr. & Comput. Eng., Colorado State Univ., Fort Collins, CO, USA
fYear :
2015
fDate :
15-21 March 2015
Firstpage :
350
Lastpage :
355
Abstract :
In this paper, a novel stochastic collocation approach for the efficient statistical analysis of high-speed interconnect networks within a SPICE environment is proposed. This approach employs the Stroud cubature rules to locate the sparse grid of collocation nodes within the random space where the deterministic SPICE simulations of the network are performed. The major advantage of this approach lies in the fact that the number of collocation nodes scales optimally (i.e. linearly) with the number of random dimensions unlike the exponential or polynomial scaling exhibited by the conventional tensor product grids or the Smolyak sparse grids respectively. This enables the quantification of the statistical moments for interconnect networks involving large random spaces at only a fraction of the typical CPU cost. The validity of this methodology is demonstrated using a numerical example.
Keywords :
SPICE; integrated circuit design; integrated circuit interconnections; stochastic processes; SPICE; Stroud cubature rules; collocation nodes; high speed interconnect; multidimensional statistical modeling; sparse grid location; statistical moment quantification; stochastic collocation; Algorithm design and analysis; Computational modeling; Integrated circuit interconnections; Numerical models; Polynomials; SPICE; Stochastic processes; Cubature rules; interconnect networks; statistical moments; stochastic collocation; transient analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility and Signal Integrity, 2015 IEEE Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4799-1992-5
Type :
conf
DOI :
10.1109/EMCSI.2015.7107713
Filename :
7107713
Link To Document :
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