DocumentCode
709306
Title
Multiphysics characterization of large-scale through-silicon-via structures
Author
Tianjian Lu ; Jian-Ming Jin ; Er-Ping Li
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
fYear
2015
fDate
22-26 March 2015
Firstpage
1
Lastpage
2
Abstract
The thermal analysis is coupled with the full-wave electromagnetic analysis in order to accurately predict the electrical behaviors of through-silicon-via (TSV) structures. The cosimulation is implemented with the finite element method. A highly efficient domain decomposition scheme is introduced into the co-simulation to handle large-scale massively coupled TSV structures.
Keywords
circuit simulation; finite element analysis; integrated circuit interconnections; large scale integration; thermal analysis; three-dimensional integrated circuits; finite element method; full-wave electromagnetic analysis; large-scale through-silicon-via structures; thermal analysis; Computational modeling; Electromagnetic analysis; Finite element analysis; Insertion loss; Integrated circuit modeling; Program processors; Thermal analysis; Finite Element Tearing and Interconnecting Multiphysics, Through-Silicon-Via;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Computational Electromagnetics (ACES), 2015 31st International Review of Progress in
Conference_Location
Williamsburg, VA
Type
conf
Filename
7109635
Link To Document