• DocumentCode
    709573
  • Title

    Partner organizations

  • fYear
    2015
  • fDate
    14-17 April 2015
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    The conference organizers greatly appreciate the support of the various corporate sponsors listed.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
  • Conference_Location
    Kyoto, Japan
  • Print_ISBN
    978-4-9040-9012-1
  • Type

    conf

  • DOI
    10.1109/ICEP-IAAC.2015.7110999
  • Filename
    7110999
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=709573