Title :
Advantage of direct etching method and process integration for TSV reliability
Author :
Sakuishi, Toshiyuki ; Murayama, Takahiro ; Morikawa, Yasuhiro
Author_Institution :
ULVAC Inc. Inst. of Semicond. & Electron. Technol., Shizuoka, Japan
Abstract :
Cost and reliability of TSV has become a challenge to mass production. Scallop free and tapered etch by direct etching method improve the coverage of deposition and reliability of cu electro plating. Taper angle controllability of direct etching method expands the possibility of TSV process integration.
Keywords :
copper alloys; electroplating; etching; integrated circuit reliability; three-dimensional integrated circuits; Cu; TSV cost; TSV reliability; copper electroplating; direct etching method; mass production; process integration; scallop free etch; taper angle controllability; tapered etch; Antennas; Controllability; Etching; Iterative closest point algorithm; Plasmas; Reliability; Direct etching; Dry etch; ICP; Scalopp-free; TSV;
Conference_Titel :
Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-4-9040-9012-1
DOI :
10.1109/ICEP-IAAC.2015.7111003
