Title :
Preparation and characterization of organic light emitting devices using hybrid encapsulation materials properties of OLED using hybrid encapuslaton materials
Author :
Ho Jung Chang ; Byung Min Park ; Sang Hee Lee ; Yang Geun Jo ; Ji Mook Kim ; Jae Jin Jung ; Jaeho Pyee
Author_Institution :
Dept. of Electron. & Electr. Eng., Dankook Univ., Yongin, South Korea
Abstract :
Many researchers have been focusing on the development of the new energy saving devices. The optoelectronic devices such as organic solar cells (OSCs) and organic light emitting diodes (OLEDs) have been regarded as the next generation energy saving devices. In addition, those devices can also be applied to the Internet of Things (IoT), which is the interconnection of identifiable objects through the wireless internet systems. In addition, IoT is expected to provide advanced connectivity of the devices, systems, and services. In this study, for future applications of smart farm and buildings, the flexible OLEDs were prepared by the spin coating and thermal evaporation methods. The stability of the devices by introducing of the hybrid encapsulation materials using organic and inorganic passivation materials were investigated. The lifetime of the devices are affected by the humidity and oxygen environment. Therefore, encapsulations using hybrid inorganic and organic materials of the devices would be important technologies in order to prevent the devices from the oxygen and moisture. As a result, the prepared OLED device with the hybrid encapsulation materials showed better stability and reliability compared with glass capped OLED devices.
Keywords :
encapsulation; organic light emitting diodes; passivation; spin coating; Internet of Things; IoT; OSC; buildings; flexible OLED; glass capped devices; hybrid encapsulation materials properties; inorganic passivation materials; next generation energy saving devices; optoelectronic devices; organic light emitting devices; organic passivation materials; organic solar cells; smart farm; spin coating; thermal evaporation methods; wireless Internet systems; Encapsulation; Glass; Internet of things; Metals; Organic light emitting diodes; Photovoltaic cells; Reliability; efficiency; hybrid encapsulation materials; internet of things; organic light emitting diodes; organic solar cells;
Conference_Titel :
Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-4-9040-9012-1
DOI :
10.1109/ICEP-IAAC.2015.7111036