DocumentCode :
709607
Title :
Experimental study for method to measure terminal part temperature of micro-electronic devices using infrared thermograph and image processing
Author :
Hirasawa, Koichi ; Aruga, Yoshinori ; Ohhashi, Yasushi ; Tomimura, Toshio
Author_Institution :
KOA Corp., Minowa, Japan
fYear :
2015
fDate :
14-17 April 2015
Firstpage :
377
Lastpage :
380
Abstract :
Concerning surface mount resistors, which are one of micro electronic devices, measurement of the terminal part temperature measurement is important from the standpoint of thermal management. When the electronic device designer uses the infrared thermograph to measure the approximate value of the terminal part temperature of the surface mount resistor, the surface hotspot of the resistor will form a so striking contrast in the thermograph image that the terminal part will be hard to be measured. The possible method for overcoming this problem is to apply a proper cutoff frequency filter to the obtained temperature distribution image, and then smooth the hotspot of the resistor (locally high temperature portion of resister surface) down near the terminal part temperature level, and finally read this hotspot temperature as the terminal part temperature. The possibility mentioned above will be discussed in this study.
Keywords :
image processing; infrared imaging; resistors; semiconductor device measurement; surface mount technology; temperature measurement; thermal management (packaging); cutoff frequency filter; electronic device designer; image processing; infrared thermograph; micro electronic devices; micro-electronic devices; surface hotspot; surface mount resistors; temperature distribution image; terminal part temperature measurement; thermal management; thermograph image; Cutoff frequency; Frequency measurement; Lenses; Resistors; Spatial resolution; Temperature distribution; Temperature measurement; infrared thermograph; resistor; spatial resolution; thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-4-9040-9012-1
Type :
conf
DOI :
10.1109/ICEP-IAAC.2015.7111039
Filename :
7111039
Link To Document :
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