DocumentCode
709613
Title
Lifetime prolongation of release agent on antireflection structure molds by means of partial-filling ultraviolet nanoimprint lithography
Author
Binti Abu Talip Yusof, Nurhafizah ; Hayashi, Tatsuya ; Taniguchi, Jun ; Hiwasa, Shin
Author_Institution
Dept. of Appl. Electron., Tokyo Univ. of Sci., Tokyo, Japan
fYear
2015
fDate
14-17 April 2015
Firstpage
418
Lastpage
421
Abstract
Release agent becomes an imperative element in ultraviolet nanoimprint lithography (UV-NIL) for preventing the adhesive resin from adhering to the surface of antireflection structures (ARS) mold. However, complete filling the resin of a high-aspect-ratio ARS mold during UV-NIL generates a strong release force (RF) that deteriorates the release agent and shortens the lifetime of the ARS mold. In this paper, we proposed a technique of partial-filling UV-NIL in order to reduce the RF and consequently, prolong the lifetime of the release agent on ARS mold. The release and optical properties of the ARS were measured to determine the lifetime of the release agent on the mold, and complete-filling UV-NIL was also executed for comparison. By means of partial-filling UV-NIL, we successfully fabricated ARS films with excellent performance up to 75th imprint compared to complete-filling UV-NIL up to the 40th imprint.
Keywords
adhesives; nanolithography; resins; soft lithography; ultraviolet lithography; RF reduction; adhesive resin prevention; antireflection structure mold; antireflection structure molds; high-aspect-ratio ARS mold; lifetime prolongation; optical properties; partial-filling UV-NIL; partial-filling ultraviolet nanoimprint lithography; release agent; release force; Fabrication; Filling; Films; Force; Nanolithography; Radio frequency; Resins; contact angle; lifetime; partial filling; release force; ultraviolet nanoimprint (NIL);
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
Conference_Location
Kyoto
Print_ISBN
978-4-9040-9012-1
Type
conf
DOI
10.1109/ICEP-IAAC.2015.7111048
Filename
7111048
Link To Document