• DocumentCode
    709613
  • Title

    Lifetime prolongation of release agent on antireflection structure molds by means of partial-filling ultraviolet nanoimprint lithography

  • Author

    Binti Abu Talip Yusof, Nurhafizah ; Hayashi, Tatsuya ; Taniguchi, Jun ; Hiwasa, Shin

  • Author_Institution
    Dept. of Appl. Electron., Tokyo Univ. of Sci., Tokyo, Japan
  • fYear
    2015
  • fDate
    14-17 April 2015
  • Firstpage
    418
  • Lastpage
    421
  • Abstract
    Release agent becomes an imperative element in ultraviolet nanoimprint lithography (UV-NIL) for preventing the adhesive resin from adhering to the surface of antireflection structures (ARS) mold. However, complete filling the resin of a high-aspect-ratio ARS mold during UV-NIL generates a strong release force (RF) that deteriorates the release agent and shortens the lifetime of the ARS mold. In this paper, we proposed a technique of partial-filling UV-NIL in order to reduce the RF and consequently, prolong the lifetime of the release agent on ARS mold. The release and optical properties of the ARS were measured to determine the lifetime of the release agent on the mold, and complete-filling UV-NIL was also executed for comparison. By means of partial-filling UV-NIL, we successfully fabricated ARS films with excellent performance up to 75th imprint compared to complete-filling UV-NIL up to the 40th imprint.
  • Keywords
    adhesives; nanolithography; resins; soft lithography; ultraviolet lithography; RF reduction; adhesive resin prevention; antireflection structure mold; antireflection structure molds; high-aspect-ratio ARS mold; lifetime prolongation; optical properties; partial-filling UV-NIL; partial-filling ultraviolet nanoimprint lithography; release agent; release force; Fabrication; Filling; Films; Force; Nanolithography; Radio frequency; Resins; contact angle; lifetime; partial filling; release force; ultraviolet nanoimprint (NIL);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-4-9040-9012-1
  • Type

    conf

  • DOI
    10.1109/ICEP-IAAC.2015.7111048
  • Filename
    7111048