Title :
Room-temperature bonding for hermetic sealing using electroplated Au seal rings with ultra-smooth surface
Author :
Kurashima, Yuichi ; Maeda, Atsuhiko ; Takagi, Hideki
Author_Institution :
Res. Center for Ubiquitous MEMS & Micro Eng. (UMEMSME), Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Tsukuba, Japan
Abstract :
We evaluated room temperature bonding characteristics of electroplated Au surfaces smoothed by lift-off method and imprint method. As a result, smoothed surfaces can make a strong bonding; on the other hand electroplated rough surface make a very weak bonding. In TEM observation, no delamination was observed at the bonding interface, which was bonded at room temperature using a smooth surface replicated by the lift-off process. Hermeticity of bonding interface prepared by smoothed surfaces was evaluated by diaphragm structures. As a result, good hermetic sealing was confirmed using the smooth surface replicated by the lift-off method.
Keywords :
bonding processes; electroplating; gold; hermetic seals; rough surfaces; Au; bonding interface; electroplated rough surface; electroplated seal rings; hermetic sealing; imprint method; lift-off method; room-temperature bonding; ultra-smooth surface; Bonding; Gold; Micromechanical devices; Rough surfaces; Silicon; Surface roughness; Surface treatment; Au-Au bonding; hermetic sealing; lift-off; room-temperature bonding;
Conference_Titel :
Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-4-9040-9012-1
DOI :
10.1109/ICEP-IAAC.2015.7111056
