New MEMS sensor process by TSV technology for smaller packaginge

MEMS (Micro Electro Mechanical System) Motion sensor such as Accelerometer and Gyroscope are composed by MEMS die which manufactured by surface micromachining process and signal processing die which is made by standard CMOS process. These two types of dies are assembled in single package of plastic mold called LGA. Current standard products have almost 3×3mm square package size for Accelerometer, and 4×4mm or less for gyroscope and combo of accelerometer and gyroscope. To realize smaller package for MEMS sensors with same performance to meet market requirement, new process technology for surface micromachining must be introduced. Key process technology is TSV (Through Silicon Vias) approach. We introduced original TSV technology for MEMS sensor products called SMERALDO, MEMS die size is reduced over 20% in average with keeping same mechanical structure. This can make realize smaller packaging, or higher performance, or multi functions sensor like smart sensor module which integrated multiple motion sensor and microprocessor.