Nano-Function Paste for power semiconductors

Author

Ikeda, Hiroaki ; Sekine, Shigenobu ; Kimura, Ryuji ; Shimokawa, Koichi ; Okada, Keiji ; Shindo, Hiroaki ; Ooi, Tatsuya ; Nagata, Makoto

Author_Institution

Napra Cooperation, Tokyo, Japan

fYear

2015

fDate

14-17 April 2015

Firstpage

482

Lastpage

485

Abstract

The Nano-Function Paste (NFP) is a conductive paste contains Cu (or Cu composite) particles with coating and Low Melting Point Alloy (LMPA) particles. Interconnects using high Cu content (70 wt%) NFP had shown shear force after 300 deg. C storage (>1,000H) was better than that of nano-Ag paste. This paper is an analysis of low Cu content (20 wt%) NFP providing; graded Cu diffusion into LMPA, inhibition of IMC voids, well controlled self-alignment capability (surface tension) for power semiconductors and SMD interconnects.

Keywords

conducting materials; interconnections; melting point; power semiconductor devices; silver; surface mount technology; voids (solid); Ag; IMC void; LMPA particle; NFP; SMD interconnection; conductive paste; controlled self-alignment capability; graded Cu diffusion; low melting point alloy particle; nanofunction paste; power semiconductor; surface tension; temperature 300 degC; Coatings; Liquids; Metals; Packaging; Surface treatment; Temperature; Transient analysis; Intermetaric Compound; SAC; solder; void;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on

Conference_Location

Kyoto

Print_ISBN

978-4-9040-9012-1

Type

conf

DOI

10.1109/ICEP-IAAC.2015.7111063

Filename

7111063