DocumentCode :
709641
Title :
Nanotwinned Cu thin film with different twin boundary orientations deposited by unbalanced magnetron sputtering
Author :
Hsin-Yuan Chen ; Kai Hung Yang ; Fan-Yi Ouyang
Author_Institution :
Dept. of Eng. & Syst. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear :
2015
fDate :
14-17 April 2015
Firstpage :
596
Lastpage :
600
Abstract :
Nanotwinned Cu thin films were fabricated on Si (100) substrate by using unbalanced magnetron sputtering (UBMS) system. By varying the deposition rate and the deposition temperature, we observed that there are two major twin orientations. One is parallel to the substrate and the other one makes an angel of 70 degree with the substrate. The effect of twin orientation on the mechanical properties and corrosive behavior was investigated in this study. The results show that the samples with 70.5 degree orientation to the substrate were harder than those with orientation parallel to the substrate The samples with more parallel type of the twin boundary would exhibit better corrosion resistance.
Keywords :
copper; corrosion resistance; hardness; metallic thin films; sputter deposition; twin boundaries; twinning; Cu; Si; Si (100) substrate; corrosion resistance; deposition rate; deposition temperature; mechanical properties; nanotwinned thin film; twin boundary orientations; unbalanced magnetron sputtering; Conductivity; Corrosion; Films; Grain boundaries; Resistance; Sputtering; Substrates; Corrosion resistance; Cu; Hardness; Nano twin; Orientation; resistivity; sputter;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-4-9040-9012-1
Type :
conf
DOI :
10.1109/ICEP-IAAC.2015.7111084
Filename :
7111084
Link To Document :
بازگشت