• DocumentCode
    709654
  • Title

    Suppression of mode-conversion by DNG material placed on differential-paired lines with bend discontinuities

  • Author

    Kayano, Yoshiki ; Inoue, Hiroshi

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Akita Univ., Akita, Japan
  • fYear
    2015
  • fDate
    14-17 April 2015
  • Firstpage
    700
  • Lastpage
    703
  • Abstract
    This paper newly attempts to propose a method for compensating the mode-conversion by double negative (DNG) material, for establishment of SI performance and suppression of imbalance (common-mode: CM) component and EMI generated by differential-paired lines with bend discontinuities. To demonstrate the impact of the DNG material on CM component, the simulated |Scd21|, which is defined as the conversion from differential-mode (DM) to CM, are evaluated. The significant suppression effectiveness of |Scd21| in the case study is achieved around 100MHz by DNG material. The suppression effectiveness at 70MHz is 10dB. It is estimated that the proposed structure is suitable for improving the SI performance and suppressing the CM in the case study. The results validate the proof of concept. The proposed method is good candidate for suppressing mode-conversion due to phase-difference.
  • Keywords
    electromagnetic interference; metamaterials; DNG material; EMI; bend discontinuities; common mode; differential-paired lines; double negative material; frequency 100 MHz; frequency 70 MHz; mode-conversion suppression; phase difference; Delays; Electromagnetic compatibility; Electromagnetic interference; Frequency response; Permeability; Permittivity; Silicon; bend; common-mode; differential-mode; differential-paired lines; double negative (DNG) material; electromagnetic interference; signal integrity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-4-9040-9012-1
  • Type

    conf

  • DOI
    10.1109/ICEP-IAAC.2015.7111101
  • Filename
    7111101