Novel impedance controllable testing socket for high speed/frequency package

In the design of traditional IC only take into the effect of IC and load board, but ignored the effect of testing sockets during testing. With testing frequency get higher and higher, signal will easily have signal integrity (SI) problem. Higher frequency couldn´t achieve goal because of the loss on the transmission path. And the most easily part cause loss was the impedance matched socket. To overcome the signal loss problem, this project proposed an ideal design of sockets. The reasons of signal loss are impedance or the long path. We can only try to shrink the path to overcome the later. And this project is to improve impedance mismatched problem. QFN (Quad Flat No Leads) for example, traditional sockets placed copper cube and thermal ground pin in the middle of sockets to release heat. And placed I/O pins under IC´s leads. Signal will pass through pogo pin and reach the load board. But signal will reflect because of impedance mismatched. This project use transmission line theory to match the impedance by change the distance between copper and I/O pin.