Embedded band-pass filter design in packaging substrate

This project designs an embedded band-pass filter. The structure can have response of band-pass filter and the characteristics of the transmission line, the vias which affect the current path and return path and the design of Electromagnetic Band Gap under the transmission line. The structure which has the EBG structure under the transmission line is better than the structure which is a transmission line with a filter, it can reduce the layout required area and cost. This project supplies a tuning table, and that can control the response by changing the parameters. To compare with the Layer3, the Type II is designed by changing the Type I. and then, the Type III is designed to increase the frequency selectivity of the structure. In the end, there have contrast plots of the real model´s measurement and HFSS simulation, so that the structure is possible.