Title :
A case study of electromigration reliability: From design point to system operations
Author :
Baozhen Li ; Muller, Paul ; Warnock, James ; Sigal, Leon ; Badami, Dinesh
Author_Institution :
IBM Syst. & Technol. Group, Essex Junction, VT, USA
Abstract :
While great efforts have been made to counter the EM reliability degradation due to technology scaling, closer cooperation is needed among semiconductor fabricators, circuit/chip designers and system integrators to ensure final product reliability. This paper presents an example of systematic EM reliability evaluation from design point definition to chip design verification, to system characterization, and finally to EM reliability monitoring from in-field operations.
Keywords :
electromigration; integrated circuit design; integrated circuit reliability; EM reliability degradation; EM reliability monitoring; chip design verification; design point; electromigration reliability; product reliability; semiconductor fabricators; system characterization; systematic EM reliability evaluation; technology scaling; Chip scale packaging; Integrated circuit reliability; Mathematical model; Reliability engineering; Temperature distribution; Temperature sensors; chip design; electromigration (EM); statistical EM budgeting; system reliability;
Conference_Titel :
Reliability Physics Symposium (IRPS), 2015 IEEE International
Conference_Location :
Monterey, CA
DOI :
10.1109/IRPS.2015.7112680
