Title :
Mitigating “No trouble found” component returns
Author :
Haggag, A. ; Sumikawa, N. ; Shaukat, A. ; Lee, J. K. Jerry ; Aghel, Nick ; Slayman, Charlie
Author_Institution :
Freescale Semicond. Inc., Austin, TX, USA
Abstract :
With VLSI scaling, “no trouble found” or NTF parts passing at the component level, but failing at board level manufacturing testing have increased due to the dominance of soft defects over hard defects. An analysis of networking and DSP NTF components shows outlying behavior in not only product parameters but also on-die process parameters revealing new mitigation opportunities. The resulting yield hit is demonstrated to be minor <;0.5% to catch NTFs that can be >50% component with high debug cost.
Keywords :
VLSI; integrated circuit testing; DSP NTF component; VLSI scaling; board level manufacturing testing; hard defect; no trouble found mitigation; on-die process parameter; soft defect; very large scale integration; Digital signal processing; Fabrics; Integrated circuits; Manufacturing; Monitoring; Switches; Testing;
Conference_Titel :
Reliability Physics Symposium (IRPS), 2015 IEEE International
Conference_Location :
Monterey, CA
DOI :
10.1109/IRPS.2015.7112710