DocumentCode
709827
Title
Stochastic and topologically aware electromigration analysis for clock skew
Author
Jain, Palkesh ; Sapatnekar, Sachin S. ; Cortadella, Jordi
Author_Institution
Customer Enablement Group, Qualcomm Technol. Inc., Bangalore, India
fYear
2015
fDate
19-23 April 2015
Abstract
An important link between individual component-level EM failures and the failure of the associated system is established in this work. Conventional EM methodologies are based on the weakest link assumption, which deems the entire system to fail as soon as the first component in the system fails. With a highly redundant circuit topology - that of a clock grid - we present algorithms for EM assessment, which allow us to incorporate and quantify the benefit from system redundancies. We demonstrate that unless such an analysis is performed, chip lifetimes are underestimated by over 2x.
Keywords
clocks; electromigration; failure analysis; reliability; EM assessment; associated system failure; chip lifetimes; clock grid; clock skew; component-level EM failures; redundant circuit topology; stochastic electromigration analysis; topologically-aware electromigration analysis; Clocks; Delays; Integrated circuit interconnections; Redundancy; Resistors; Wires; clock; clock-grid; delay-degradation; electromigration; skew;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2015 IEEE International
Conference_Location
Monterey, CA
Type
conf
DOI
10.1109/IRPS.2015.7112714
Filename
7112714
Link To Document