• DocumentCode
    709827
  • Title

    Stochastic and topologically aware electromigration analysis for clock skew

  • Author

    Jain, Palkesh ; Sapatnekar, Sachin S. ; Cortadella, Jordi

  • Author_Institution
    Customer Enablement Group, Qualcomm Technol. Inc., Bangalore, India
  • fYear
    2015
  • fDate
    19-23 April 2015
  • Abstract
    An important link between individual component-level EM failures and the failure of the associated system is established in this work. Conventional EM methodologies are based on the weakest link assumption, which deems the entire system to fail as soon as the first component in the system fails. With a highly redundant circuit topology - that of a clock grid - we present algorithms for EM assessment, which allow us to incorporate and quantify the benefit from system redundancies. We demonstrate that unless such an analysis is performed, chip lifetimes are underestimated by over 2x.
  • Keywords
    clocks; electromigration; failure analysis; reliability; EM assessment; associated system failure; chip lifetimes; clock grid; clock skew; component-level EM failures; redundant circuit topology; stochastic electromigration analysis; topologically-aware electromigration analysis; Clocks; Delays; Integrated circuit interconnections; Redundancy; Resistors; Wires; clock; clock-grid; delay-degradation; electromigration; skew;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2015 IEEE International
  • Conference_Location
    Monterey, CA
  • Type

    conf

  • DOI
    10.1109/IRPS.2015.7112714
  • Filename
    7112714