Title :
Radiation-induced soft error rate analyses for 14 nm FinFET SRAM devices
Author :
Soonyoung Lee ; Ilgon Kim ; Sungmock Ha ; Cheong-sik Yu ; Jinhyun Noh ; Sangwoo Pae ; Jongwoo Park
Author_Institution :
Technol. Quality & Reliability, Samsung Electron., Yongin, South Korea
Abstract :
Radiation-induced Soft Error Rate (SER) of SRAM built in 14nm FinFET on bulk technology was extensively characterized. Two different SRAM cells, high-performance (HP) and high-density (HD), were irradiated with alpha particles, thermal neutrons, and high-energy neutrons. Empirical results reveal excellent SER performance of FinFET compared to the prior technology nodes, drastically reducing SER FIT rate by 5-10X. It is found that HP cell is more sensitive to a single event upset than HD cell design. We will discuss the effects of charge collection efficiency as one of major parameter and present supporting simulation results.
Keywords :
MOSFET; SRAM chips; radiation hardening (electronics); FinFET SRAM devices; HD cell design; HP cell; SER; alpha particles; bulk technology; charge collection efficiency; high-density cells; high-energy neutrons; high-performance cells; radiation-induced soft error rate analyses; single event upset; size 14 nm; technology nodes; thermal neutrons; Alpha particles; FinFETs; High definition video; Neutrons; SRAM cells; Single event upsets; 14nm; Alpha Particle; Bulk FinFET; Charge collection; High-Energy Neutron; Radiation; SRAM; Single Event; Soft Error; Thermal Neutron;
Conference_Titel :
Reliability Physics Symposium (IRPS), 2015 IEEE International
Conference_Location :
Monterey, CA
DOI :
10.1109/IRPS.2015.7112728