DocumentCode :
709849
Title :
Commercialization and reliability of 600 V GaN power switches
Author :
Kikkawa, Toshihide ; Hosoda, Tsutomu ; Shono, Ken ; Imanishi, Kenji ; Asai, Yoshimori ; YiFeng Wu ; Likun Shen ; Smith, Kurt ; Dunn, Dixie ; Chowdhury, Saurabh ; Smith, Peter ; Gritters, John ; McCarthy, Lee ; Barr, Ronald ; Lal, Rakesh ; Mishra, Umesh ;
Author_Institution :
Transphorm Japan, Inc., Aizu-Wakamatsu, Japan
fYear :
2015
fDate :
19-23 April 2015
Abstract :
The reliability of 600 V GaN power switches, fabricated in a silicon CMOS foundry, has been demonstrated. JEDEC qualification of cascode packages and the long term reliability of GaN power switches has been estimated for the first and shown to be greater than a million hours. Excellent switched/dynamic on-resistance up to 1000 V and breakdown voltage over 1500 V indicate the suitability of these devices for switching up to 480 V. Detailed data of high temperature reverse bias (HTRB) test is shown. High temperature DC stress test and high voltage off-state stress tests also corroborate the high reliability of these devices. This suite of initial, JEDEC & accelerated stress tests show that GaN-on-silicon power switches are ready for many commercial and industrial applications, would significantly reduce switching losses and system size and will impact all areas of electricity conversion, ranging from tablet chargers to photovoltaic inverters and electric vehicles.
Keywords :
CMOS integrated circuits; III-V semiconductors; elemental semiconductors; gallium compounds; integrated circuit packaging; integrated circuit testing; life testing; power semiconductor switches; semiconductor device packaging; semiconductor device reliability; semiconductor device testing; silicon; wide band gap semiconductors; GaN-Si; HTRB testing; JEDEC qualification; accelerated stress testing; cascode packaging; electric vehicle; electricity conversion; high temperature DC stress testing; high temperature reverse bias testing; high voltage off-state stress testing; photovoltaic inverter; power switch; reliability; silicon CMOS foundry; switched-dynamic on-resistance; switching loss; tablet charger; voltage 600 V; Gallium nitride; HEMTs; Reliability; Silicon; Stress; Switches; Temperature measurement; GaN power switch; HEMT; cascode; gallium nitride; reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium (IRPS), 2015 IEEE International
Conference_Location :
Monterey, CA
Type :
conf
DOI :
10.1109/IRPS.2015.7112766
Filename :
7112766
Link To Document :
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