Title :
Mechanical reliability assessment of 28nm Back End of Line (BEoL) stack using finite element analysis and validation
Author :
Machani, Kashi Vishwanath ; Geisler, Holm ; Breuer, Dirk ; Kuechenmeister, Frank ; Paul, Jens
Author_Institution :
GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, Dresden, Germany
Abstract :
In order to address the Chip-Package Interaction (CPI) challenges at an early stage of the product development, GLOBALFOUNDRIES has developed Finite Element (FE) models to simulate the mechanical stress in Backend of Line (BEoL). This paper elaborates the methodology involved in developing a single bump simulation model to assess failure risk under mechanical loading. The paper also highlights the FE models validation by comparing the simulation results to the experimental test data.
Keywords :
electronics packaging; failure analysis; finite element analysis; reliability; risk management; BEoL stack; CPI; FE model; GLOBALFOUNDRIES; back end of line stack; chip-package interaction; failure risk assessment; finite element analysis; mechanical reliability assessment; mechanical stress simulation; product development; single bump simulation model; Computational modeling; Passivation; Polyimides; Solid modeling; Strain; Stress; Three-dimensional displays; BABSI simulation; BABSI test; BEoL; CPI; Copper pillar; FEM; flip-chip assembly; ultralow-k ILD;
Conference_Titel :
Reliability Physics Symposium (IRPS), 2015 IEEE International
Conference_Location :
Monterey, CA
DOI :
10.1109/IRPS.2015.7112789
