Mechanical reliability assessment of 28nm Back End of Line (BEoL) stack using finite element analysis and validation

Author

Machani, Kashi Vishwanath ; Geisler, Holm ; Breuer, Dirk ; Kuechenmeister, Frank ; Paul, Jens

Author_Institution

GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, Dresden, Germany

fYear

2015

fDate

19-23 April 2015

Abstract

In order to address the Chip-Package Interaction (CPI) challenges at an early stage of the product development, GLOBALFOUNDRIES has developed Finite Element (FE) models to simulate the mechanical stress in Backend of Line (BEoL). This paper elaborates the methodology involved in developing a single bump simulation model to assess failure risk under mechanical loading. The paper also highlights the FE models validation by comparing the simulation results to the experimental test data.

Keywords

electronics packaging; failure analysis; finite element analysis; reliability; risk management; BEoL stack; CPI; FE model; GLOBALFOUNDRIES; back end of line stack; chip-package interaction; failure risk assessment; finite element analysis; mechanical reliability assessment; mechanical stress simulation; product development; single bump simulation model; Computational modeling; Passivation; Polyimides; Solid modeling; Strain; Stress; Three-dimensional displays; BABSI simulation; BABSI test; BEoL; CPI; Copper pillar; FEM; flip-chip assembly; ultralow-k ILD;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium (IRPS), 2015 IEEE International

Conference_Location

Monterey, CA

Type

conf

DOI

10.1109/IRPS.2015.7112789

Filename

7112789