DocumentCode :
710385
Title :
SoC test integration platform
Author :
Kifli, Augusli ; Wu, K.C.
Author_Institution :
Faraday Technol. Corp., Hsinchu, Taiwan
fYear :
2015
fDate :
27-29 April 2015
Firstpage :
1
Lastpage :
2
Abstract :
Most of the ASIC designs that we currently encountered are SoC in nature. The success of SoC design methodology relies on the design reuse of existing cores (IPs). The tasks of integrating the cores and creating successful tests for the SoC should not be overlooked. These tasks may need a considerable amount of time from the designers and are inherently error-prone. Conventionally, designers have to understand the test requirement of all the IPs used in the SoC. A test plan is then created and the corresponding test wrapper for the IPs is added and integrated into the SoC design. Besides IPs test integration, designers typically need to plan for the scan DfT, test compression, test wrapper, memory BIST, and boundary scan. The above tasks are pretty standard, yet they are tedious and error-prone.
Keywords :
built-in self test; error analysis; logic circuits; microprocessor chips; system-on-chip; ASIC designs; DfT; IP core test integration; SoC design methodology; SoC test integration platform; application specific integrated circuits; boundary scan; built-in self test; error prone; memory BIST; system-on-chip; test compression; test plan; test requirement; test wrapper; Built-in self-test; Clocks; Design methodology; IP networks; Planning; Productivity; System-on-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Design, Automation and Test (VLSI-DAT), 2015 International Symposium on
Conference_Location :
Hsinchu
Type :
conf
DOI :
10.1109/VLSI-DAT.2015.7114546
Filename :
7114546
Link To Document :
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