DocumentCode :
71041
Title :
An Overview of Process and Product Requirements for Next Generation Thin Film Electronics, Advanced Touch Panel Devices, and Ultra High Barriers
Author :
Morrison, N.A. ; Stolley, T. ; Hermanns, U. ; Reus, A. ; Deppisch, T. ; Bolandi, Hooman ; Melnik, Yuriy ; Singh, V. ; Griffith Cruz, J.
Author_Institution :
Appl. Mater. Web Coating GmbH, Alzenau, Germany
Volume :
103
Issue :
4
fYear :
2015
fDate :
Apr-15
Firstpage :
518
Lastpage :
534
Abstract :
Roll-to-Roll (R2R) production of thin film based display components (e.g., active matrix TFT backplanes and touch screens) combine the advantages of the use > of inexpensive, lightweight, and flexible substrates with high throughput production. Significant cost reduction opportunities can also be found in terms of processing tool capital cost, utilized substrate area, and process gas flow when compared with batch processing systems. Applied Materials has developed a variety of different web handling and coating technologies/platforms to enable high volume R2R manufacture of thin film silicon solar cells, TFT active matrix backplanes, touch screen devices, and ultra-high barriers for organic electronics. The work presented in this chapter therefore describes the latest advances in R2R PVD processing and principal challenges inherent in moving from lab and pilot scale manufacturing to high volume manufacturing of flexible display devices using CVD for the deposition of active semiconductors layers, gate insulators, and high performance barrier/passivation layers. This chapter also includes brief description of the process and cost advantage of the use of rotatable PVD source technologies (primarily for use in flexible touch panel manufacture) and a summary of the current performance levels obtained for R2R processed amorphous silicon and IGZO TFT backplanes. Results will also be presented for barrier film for final device/frontplane encapsulation for display applications.
Keywords :
amorphous semiconductors; chemical vapour deposition; flexible displays; gallium compounds; indium compounds; insulators; passivation; protective coatings; solar cells; thin film transistors; CVD deposition; IGZO TFT backplanes; InGaZnO; R2R production; Si; active matrix TFT backplanes; active semiconductors layers; amorphous silicon; coating technology; display components; flexible display devices; flexible touch panel manufacture; gate insulators; high performance barrier-passivation layers; next generation thin film electronics; organic electronics; process requirements; product requirements; roll-to-roll production; rotatable PVD source technology; thin film silicon solar cells; tool capital cost; touch panel devices; ultra high barriers; ultrahigh barriers; utilized substrate area; volume manufacturing; web handling; Backplanes; Coatings; Flexible electronics; Substrates; Thin film devices; Thin film transistors; Flexible electronics; flexible manufacturing systems; lithography; thin film transistors;
fLanguage :
English
Journal_Title :
Proceedings of the IEEE
Publisher :
ieee
ISSN :
0018-9219
Type :
jour
DOI :
10.1109/JPROC.2015.2408052
Filename :
7110425
Link To Document :
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