Title :
Optical interconnection between III–V chips on Si by using photonic wire bonding
Author :
Zhichen Gu ; Amemiya, Tomohiro ; Ishikawa, Atsushi ; Hiratani, Takuo ; Suzuki, Junichi ; Nishiyama, Nobuhiko ; Tanaka, Takuo ; Arai, Shigehisa
Author_Institution :
Dept. of Electr. & Electron. Eng., Tokyo Inst. of Technol., Tokyo, Japan
Abstract :
We connected two III-V laser and photodiode chips on Si substrate by using three-dimensional polymeric wires based on two-photon polymerization. We achieved an enhancement of the transmitting efficiency through PWB compare to the free-space transmission.
Keywords :
III-V semiconductors; integrated optics; integrated optoelectronics; lead bonding; optical fabrication; optical interconnections; optical polymers; photodiodes; polymerisation; semiconductor lasers; silicon; two-photon processes; III-V laser; PWB; Si; free-space transmission; optical interconnection; photodiode chips; photonic wire bonding; three-dimensional polymeric wires; transmitting efficiency; two-photon polymerization; Bonding; Couplings; Measurement by laser beam; Optical interconnections; Photodiodes; Photonics; Polymers;
Conference_Titel :
Optical Interconnects Conference (OI), 2015 IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4799-8178-6
DOI :
10.1109/OIC.2015.7115715
