DocumentCode
710635
Title
Resiliency challenges in sub-10nm technologies
Author
Aitken, Rob ; Cannon, Ethan H. ; Pant, Mondira ; Tahoori, Mehdi B.
Author_Institution
ARM, San Jose, CA, USA
fYear
2015
fDate
27-29 April 2015
Firstpage
1
Lastpage
4
Abstract
Improvements in chip manufacturing technology, driven by high degree of integration due to small device sizes and additional complex functionalities enabled by heterogeneous integration, have propelled an astonishing growth of computing systems. While the pervasiveness of these systems enables emerging application domains, however, this trend is facing serious challenges, both at device and system levels. As the minimum feature size continues to shrink, a host of vulnerabilities influence the robustness, reliability, and resiliency of embedded and critical systems. Some of these factors are caused by the stochastic nature of the nanoscale manufacturing process, while other factors appear because of high frequencies and nanoscale features. This paper overviews the vision by some of the key industrial players regarding the emerging resiliency challenges faced at the extreme nanoscale technologies.
Keywords
embedded systems; integrated circuit reliability; manufacturing processes; microprocessor chips; nanoelectronics; chip manufacturing technology; critical systems; embedded systems; heterogeneous integration; key industrial players; nanoscale manufacturing process; reliability systems; resiliency challenges; sub-10nm technology; Aging; Degradation; FinFETs; Integrated circuit reliability; Timing;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Test Symposium (VTS), 2015 IEEE 33rd
Conference_Location
Napa, CA
Type
conf
DOI
10.1109/VTS.2015.7116281
Filename
7116281
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