DocumentCode :
7109
Title :
a-IGZO TFTs With Inductively Coupled Plasma Chemical Vapor Deposited {\\rm SiO}_{x} Gate Dielectric
Author :
Xiang Xiao ; Wei Deng ; Xin He ; Shengdong Zhang
Author_Institution :
Sch. of Electron. & Comput. Eng., Peking Univ., Shenzhen, China
Volume :
60
Issue :
8
fYear :
2013
fDate :
Aug. 2013
Firstpage :
2687
Lastpage :
2690
Abstract :
In this brief, amorphous indium-gallium-zinc oxide (a-IGZO) thin-film transistors (TFTs) are fabricated at . Inductively coupled plasma chemical vapor deposition (ICP-CVD) is used to grow SiOx gate dielectric of the a-IGZO TFTs. The fabricated devices exhibit a high saturation mobility of 26.85 cm2/V·s, a steep subthreshold swing of 0.145 V/decade, and an ON/OFF current ratio of 2.3×107. Atomic force microscope and scanning electron microscope images show that the surface characteristics of the ICP-CVD SiOx gate dielectric are much superior to those of the conventional plasma-enhanced CVD SiOx. It is suggested that the superior surface characteristics of the ICP-CVD SiOx are the main origin of the high performance of the a-IGZO TFTs with the ICP-CVD SiOx gate dielectric.
Keywords :
amorphous semiconductors; atomic force microscopy; dielectric thin films; gallium compounds; indium compounds; plasma CVD; scanning electron microscopy; silicon compounds; thin film transistors; zinc compounds; ICP-CVD; InGaZnO; SiO; SiOx gate dielectric; a-IGZO TFT; amorphous indium-gallium-zinc oxide; atomic force microscope; inductively coupled plasma chemical vapor deposition; scanning electron microscope images; thin-film transistors; Amorphous indium–gallium–zinc oxide (a-IGZO); gate dielectric; inductively coupled plasma chemical vapor deposition (ICP-CVD); low temperature; thin-film transistors (TFTs);
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2013.2266414
Filename :
6545311
Link To Document :
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