DocumentCode
711140
Title
Aerospace electronics reliability: Could it be predicted in a cost-effective fashion?
Author
Bernstein, Joseph B.
Author_Institution
Dept. of Electr. Eng., Ariel Univ., Ariel, Israel
fYear
2015
fDate
7-14 March 2015
Firstpage
1
Lastpage
6
Abstract
We present a method for predicting the failure rate, and thus the reliability of an electronic system by summing the failure rate of each known failure mechanism. We use a competing acceleration factor methodology by combining the physics of failure for each mechanism with their effects as observed by High/Low temperature and High/Low voltage stresses. Our method assumes that lifetime of each of its failure mechanisms follows constant rate distribution and each mechanism is independently accelerated by the stress factors, which include also frequency, current, and other factors that can be entered into a reliability model. The overall failure rate is thus, also follows an exponential distribution and is described in the standard FIT (Failure unIT or Failure in Time). The method combines mathematical models for known failure mechanism and solves them simultaneously at a multiplicity of accelerated life tests to find a consistent set of weighting factors for each mechanism. The result of solving the system of equations is a more accurate and a unique combination for each system model by proportional summation of each of the contributing failure mechanisms.
Keywords
aerospace testing; exponential distribution; failure analysis; life testing; reliability; space vehicle electronics; FIT standard; accelerated life tests; acceleration factor methodology; aerospace electronics reliability model; constant rate distribution; electronic system; exponential distribution; failure in time; failure mechanism; failure rate prediction; failure unit; high-low temperature stresses; high-low voltage stresses; mathematical models; weighting factors; Acceleration; Failure analysis; Life estimation; Qualifications; Reliability; Temperature; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Aerospace Conference, 2015 IEEE
Conference_Location
Big Sky, MT
Print_ISBN
978-1-4799-5379-0
Type
conf
DOI
10.1109/AERO.2015.7118899
Filename
7118899
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