• DocumentCode
    711697
  • Title

    Design and simulation of 2.5 GHz system-in-a-package module

  • Author

    Hussein, Yasser A.

  • Author_Institution
    PedaSoft LLC, Chandler, AZ, USA
  • fYear
    2015
  • fDate
    13-15 April 2015
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    This paper presents a new 2.5 GHz System in a package module. A new approach for S-parameters and RF power measurements of 2-port differential amplifiers is implemented. The new method is based on 2-port measurements of the output differential lines, while having the input ports fed with true differential base-band signals. The advantages of using this technique are several including eliminating the need to use 4-port vector network analyzers and baluns that are known to degrade measurements accuracy. The new design is validated by comparing simulation with measured data of the complete wireless system in a package (SiP) module operating at 2.5 GHz, which agreed quite well.
  • Keywords
    UHF amplifiers; baluns; differential amplifiers; integrated circuit measurement; network analysers; system-in-package; 2-port measurements; RF power measurements; S-parameters; baluns; differential amplifiers; differential base-band signals; frequency 2.5 GHz; network analyzers; system-in-a-package module; Indexes; Phase measurement; Ports (Computers); Power measurement; Q measurement; Radio frequency; Radiofrequency integrated circuits; Active Modeling; Differential Amplifiers; Differential Impedance; Linear Modeling; Macro-models; Non-linear models; S-parameters; SiP;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless and Microwave Technology Conference (WAMICON), 2015 IEEE 16th Annual
  • Conference_Location
    Cocoa Beach, FL
  • Type

    conf

  • DOI
    10.1109/WAMICON.2015.7120387
  • Filename
    7120387