Characterization of printed circuit board materials & manufacturing technologies for high frequency applications up to 110 GHz

Author

Huber, Oliver ; Faseth, Thomas ; Arthaber, Holger ; Schlaffer, Erich

Author_Institution

Inst. of Electrodynamics, Vienna Univ. of Technol., Vienna, Austria

fYear

2015

fDate

13-15 April 2015

Firstpage

1

Lastpage

4

Abstract

This paper focuses on the description of loss behavior up to 110 GHz for two commercially widely used transmission line modes, microstrip (MS) and conductor backed coplanar waveguide (CBCPW). Within this investigation special attention has been drawn to the applied manufacturing processes as each process has distinct tolerances and etching behavior. The measured data is based on a comparison of 50 Ω transmission lines manufactured on two different substrates and for two structuring processes, pattern plating and panel plating.

Keywords

microstrip lines; millimetre wave circuits; printed circuit manufacture; conductor backed coplanar waveguide; etching behavior; high frequency applications; panel plating; pattern plating; printed circuit board manufacturing technologies; printed circuit board materials; process tolerance; structuring process; transmission line mode; transmission lines; Manufacturing; Nickel; Transmission line measurements; Manufacturing technology; copper loss; dielectric loss; loss measurement; microwave circuits; microwave propagation; passive circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Wireless and Microwave Technology Conference (WAMICON), 2015 IEEE 16th Annual

Conference_Location

Cocoa Beach, FL

Type

conf

DOI

10.1109/WAMICON.2015.7120406

Filename

7120406