DocumentCode
712563
Title
Device technologies for integrated packaged transceivers
Author
Griffin, Robert A.
Author_Institution
Oclaro Inc., USA
fYear
2015
fDate
22-26 March 2015
Firstpage
1
Lastpage
1
Abstract
Summary form only given. InP-based PICs have enabled a first generation of CFP2-ACO modules for line-side 100Gb/s deployment. A number of options are available to scale to higher volumes and enable high density transport up to 400Gb/s.
Keywords
indium compounds; optical transceivers; CFP2-ACO module; InP; InP-based PIC; bit rate 100 Gbit/s; integrated packaged transceiver; line-side deployment; Integrated optics; Optical devices; Transceivers;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Fiber Communications Conference and Exhibition (OFC), 2015
Conference_Location
Los Angeles, CA
Type
conf
Filename
7121923
Link To Document