Title :
High bandwidth transceivers using heterogeneous integration on silicon
Author_Institution :
Aurrion Inc., Goleta, CA, USA
Abstract :
The heterogeneous integration of InP material into a silicon photonics wafer flow enables high bandwidth transceivers to be fabricated using established silicon foundry infrastructure for both fabrication and packaging.
Keywords :
III-V semiconductors; elemental semiconductors; indium compounds; integrated optics; optical fabrication; optical transceivers; packaging; silicon; InP-Si; fabrication; heterogeneous integration; high bandwidth transceivers; packaging; silicon foundry infrastructure; silicon photonics; wafer flow; Bandwidth; III-V semiconductor materials; Indium phosphide; Marine animals; Silicon photonics; Transceivers;
Conference_Titel :
Optical Fiber Communications Conference and Exhibition (OFC), 2015
Conference_Location :
Los Angeles, CA
