Title :
Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability
Author :
Barwicz, Tymon ; Taira, Yoichi ; Lichoulas, Ted W. ; Boyer, Nicolas ; Numata, Hidetoshi ; Martin, Yves ; Jae-Woong Nah ; Takenobu, Shotaro ; Janta-Polczynski, Alexander ; Kimbrell, Eddie L. ; Leidy, Robert ; Khater, Marwan ; Kamlapurkar, Swetha ; Engelman
Author_Institution :
IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count.
Keywords :
assembling; electronics packaging; integrated circuits; assembly cost; cost-efficiency; high-throughput microelectronic assembly lines; microelectronic packaging facilities; optical port-count; photonic packaging; scalability; silicon photonic packaging; Assembly; Microelectronics; Optical fiber couplers; Packaging; Photonics; Polymers;
Conference_Titel :
Optical Fiber Communications Conference and Exhibition (OFC), 2015
Conference_Location :
Los Angeles, CA
