Title :
An ultra low power 3D integrated intra-chip silicon electronic-photonic link
Author :
Timurdogan, Erman ; Zhan Su ; Settaluri, Krishna ; Sen Lin ; Moazeni, Sajjad ; Chen Sun ; Leake, Gerald ; Coolbaugh, Douglas D. ; Moss, Benjamin R. ; Moresco, Michele ; Stojanovic, Vladimir ; Watts, Michael R.
Author_Institution :
Res. Lab. of Electron., Massachusetts Inst. of Technol., Cambridge, MA, USA
Abstract :
A record low energy (250fJ/bit) intra-chip electronic-photonic link is demonstrated at 5Gb/s on a 3D-integrated wafer using through-oxide-vias (1.45fF-per-via) for the first time. The receiver sensitivity was -19.3dBm and the on-chip laser energy was 6fJ/bit.
Keywords :
elemental semiconductors; integrated optics; low-power electronics; optical links; silicon; three-dimensional integrated circuits; 3D-integrated wafer; Si; bit rate 5 Gbit/s; intrachip electronic-photonic link; on-chip laser energy; receiver sensitivity; through-oxide-vias; ultra low power 3D integration; Detectors; Modulation; Optical transmitters; Photonics; Receivers; Silicon; System-on-chip;
Conference_Titel :
Optical Fiber Communications Conference and Exhibition (OFC), 2015
Conference_Location :
Los Angeles, CA
