• DocumentCode
    712872
  • Title

    Conductivity modulated on-axis 4H-SiC 10+ kV PiN diodes

  • Author

    Salemi, Arash ; Elahipanah, Hossein ; Buono, Benedetto ; Hallen, Anders ; Hassan, Jawad Ul ; Bergman, Peder ; Malm, Gunnar ; Zetterling, Carl-Mikael ; Ostling, Mikael

  • Author_Institution
    Integrated Devices & Circuits, KTH R. Inst. of Technol., Kista, Sweden
  • fYear
    2015
  • fDate
    10-14 May 2015
  • Firstpage
    269
  • Lastpage
    272
  • Abstract
    Degradation-free ultrahigh-voltage (>10 kV) PiN diodes using on-axis 4H-SiC with low forward voltage drop (VF = 3.3 V at 100 A/cm2) and low differential on-resistance (RON = 3.4 mΩ.cm2) are fabricated, measured, and analyzed by device simulation. The devices show stable on-state characteristics over a broad temperature range up to 300 °C. They show no breakdown up to 10 kV, i.e., the highest blocking capability for 4H-SiC devices using on-axis to date. The minority carrier lifetime (τP) is measured after epitaxial growth by time resolved photoluminescence (TRPL) technique at room temperature. The τP is measured again after device fabrication by open circuit voltage decay (OCVD) up to 500 K.
  • Keywords
    carrier lifetime; p-i-n diodes; photoluminescence; semiconductor device manufacture; semiconductor device models; silicon compounds; wide band gap semiconductors; OCVD; PiN diodes; SiC; TRPL technique; degradation free ultrahigh-voltage; device fabrication; device simulation; epitaxial growth; minority carrier lifetime; open circuit voltage decay; time resolved photoluminescence technique; voltage 10 kV; Charge carrier lifetime; Conductivity; PIN photodiodes; Silicon carbide; Temperature; Temperature measurement; Voltage measurement; OCVD; On-axis 4H-SiC; PiN diode; VF; bipolar degradation-free; breakdown voltage; lifetime enhancement; on-resistance; ultrahigh-voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices & IC's (ISPSD), 2015 IEEE 27th International Symposium on
  • Conference_Location
    Hong Kong
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4799-6259-4
  • Type

    conf

  • DOI
    10.1109/ISPSD.2015.7123441
  • Filename
    7123441