• DocumentCode
    713311
  • Title

    Electro-thermal virtual prototyping of a Rogowski Coil sensor system

  • Author

    Rodriguez Estupinan, Juan Sebastian ; Vachoux, Alain ; Pascal, Joris

  • Author_Institution
    Microelectron. Syst. Lab. - LSM, Ecole Polytech. Fed. de Lausanne, Lausanne, Switzerland
  • fYear
    2015
  • fDate
    17-19 March 2015
  • Firstpage
    1451
  • Lastpage
    1456
  • Abstract
    An electro-thermal model of a Rogowski Coil sensor system is here described. A co-design methodology between VHDL-AMS and Finite Element Analysis (FEA) has been used for modeling the entire system. The proposed modeling strategy uses geometrical FEA to complete a time-dependent parametrical heat transfer model, which can be implemented in VHDL-AMS or in any other similar hardware description language. This is especially useful for performing simulations with the embedded signal processing electronics of the sensor. Important geometrical, environmental and inner material properties of the Rogowski Coil sensor system, which are difficult, or even impossible to simulate dynamically in a classical lumped-element model, are taken into account indirectly in the proposed model. This allows to study the cross-domain effects in the complete system.
  • Keywords
    coils; electronic engineering computing; finite element analysis; hardware description languages; sensors; signal processing; virtual prototyping; FEA; Rogowski coil sensor system; VHDL-AMS; codesign methodology; electro-thermal virtual prototyping; embedded signal processing electronics; finite element analysis; hardware description language; Atmospheric modeling; Geometry; Heat transfer; Mathematical model; Sensor systems; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Technology (ICIT), 2015 IEEE International Conference on
  • Conference_Location
    Seville
  • Type

    conf

  • DOI
    10.1109/ICIT.2015.7125301
  • Filename
    7125301