DocumentCode :
716072
Title :
Evaluation of elastic properties of SiO2 thin films by ultrasonic microscopy
Author :
Sakamoto, Kensuke ; Omori, Tatsuya ; Kushibiki, Jun-ichi ; Matsuda, Satoru ; Hashimoto, Ken-ya
Author_Institution :
Grad. Sch. of Eng., Chiba Univ., Chiba, Japan
fYear :
2015
fDate :
12-16 April 2015
Firstpage :
793
Lastpage :
796
Abstract :
This paper describes evaluation of stiffnesses of SiO2 thin films when the anisotropy in elasticity is taken into account. The authors measured the propagation direction θ dependence of the water-loaded surface acoustic waves (SAW) velocity, and tried to estimate stiffnesses of SiO2 films from the measured θ dependence. The result indicates that SiO2 films possess the strong 6mm anisotropy. Namely, stiffnesses normal to the surface are significantly lager than those along the surface. This anisotropy may be induced during the deposition or caused by variation of film properties in the thickness direction.
Keywords :
acoustic microscopy; amorphous semiconductors; elasticity; mechanical variables measurement; semiconductor thin films; silicon compounds; surface acoustic waves; ultrasonic measurement; ultrasonic velocity; SiO2; anisotropy; elastic properties evaluation; elasticity; size 6 mm; thickness direction; thin film stiffness evaluation; ultrasonic microscopy; water-loaded surface acoustic waves velocity; Anisotropic magnetoresistance; Microscopy; Silicon; Substrates; Surface acoustic waves; Velocity measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Frequency Control Symposium & the European Frequency and Time Forum (FCS), 2015 Joint Conference of the IEEE International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4799-8865-5
Type :
conf
DOI :
10.1109/FCS.2015.7138960
Filename :
7138960
Link To Document :
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