DocumentCode
71843
Title
High
and Low Intergranular Exchange Coupling of Postannealed CoPt-WO3 Granular Film
Author
Kim Kong Tham ; Hinata, Shintaro ; Saito, Sakuyoshi ; Takahashi, Masaharu
Author_Institution
Tanaka Kikinzoku Kogyo K. K., Tokyo, Japan
Volume
50
Issue
11
fYear
2014
fDate
Nov. 2014
Firstpage
1
Lastpage
4
Abstract
Magnetic properties and microstructure of Co80Pt20-30 vol.% (Al2O3, TiO2, WO3) and Co82.4Pt17.6-27.7 vol.% SiO2 granular films postannealed at various temperatures in a heat-treating furnace were investigated. In this paper, it is found that among these granular films, CoPt-WO3 granular film shows the highest coercivity (Hc) because of low intergranular exchange coupling of well-isolated magnetic grains. Furthermore, the Hc is enhanced with postannealing because of the increase of the magnetic anisotropy field (Hkgrain) and uniaxial magnetocrystalline anisotropy (Kugrain) of the columnar growth magnetic grains. The increase of Kugrain for the postannealed granular film primarily originates from the reduction of the stacking faults as well as the lattice constant ratio.
Keywords
aluminium compounds; annealing; cobalt alloys; coercive force; discontinuous metallic thin films; exchange interactions (electron); grain growth; granular materials; lattice constants; magnetic anisotropy; platinum alloys; stacking faults; titanium compounds; tungsten compounds; Co80Pt20-Al2O3; Co80Pt20-TiO2; Co80Pt20-WO3; Co82.4Pt17.6-SiO2; coercivity; columnar growth magnetic grains; heat-treating furnace; high-Ku intergranular exchange coupling; lattice constant ratio; low-intergranular exchange coupling; magnetic anisotropy; magnetic properties; microstructure; post-annealed CoPt-WO3 granular film; stacking faults; uniaxial magnetocrystalline anisotropy; Magnetic properties; Microstructure; Perpendicular magnetic anisotropy; Perpendicular magnetic recording; Stacking; CoPt-WO3 granular film; high Ku; perpendicular magnetic recording; postannealing;
fLanguage
English
Journal_Title
Magnetics, IEEE Transactions on
Publisher
ieee
ISSN
0018-9464
Type
jour
DOI
10.1109/TMAG.2014.2321025
Filename
6971658
Link To Document