Title :
Unique features of electronic device testing using NI-technologies
Author :
Butin, V. ; Butina, A. ; Chubrukov, F.
Author_Institution :
FSUE VNIIA, All-Russia Res. Inst. of Automatics, Moscow, Russia
Abstract :
The paper describes methodological problems of functional check and parametric testing of electronic devices by using modular NI PXI-devices in various environmental conditions.The operation algorithm of developed automated test system can analyze the time measurement of various parameters; it synchronizes time between measurements, creates experimental data back-ups and minimizes measurement time. The log-file allows detecting the sequence of errors during the functional check of electronic device. The interface module controls the data exchange by multiplex channel and it is integrated in automated test system. The application-dependent software provides the remote parameters measurement and research control. The control program realizes the switching of the device power supply to external power source in case of the control parameters exceeding the limits. The developed test system has been approbated at modeling and simulation facilities of ROSATOM companies such as FSUE VNIIA (Moscow, Russia), FSUE RISI (Lytkarino, Russia) and SSC RF - IPPE (Obninsk, Russia).
Keywords :
automatic testing; electron device testing; error detection; FSUE RISI; FSUE VNIIA; NI-technology; ROSATOM company; SSC RF-IPPE; application-dependent software; automated test system; control program; device power supply; electronic device testing; error sequence detection; experimental data back-up; external power source; functional check; interface module; log-file; modular NI PXI-device; multiplex channel; national instruments PXI; remote parameter measurement; research control; time measurement; Couplings; Microcontrollers; Nickel; Power supplies; Resistance; Software; Testing; PXI; electronic device; multiplex channel; testing algorithm;
Conference_Titel :
Control and Communications (SIBCON), 2015 International Siberian Conference on
Conference_Location :
Omsk
Print_ISBN :
978-1-4799-7102-2
DOI :
10.1109/SIBCON.2015.7147314