DocumentCode :
718846
Title :
A study of thermoplastic properties of a novel photoresist
Author :
Lou, Kevin ; Sheu, Gene ; Shao-Ming Yang ; Laksana, Pradhana Jati Budhi
Author_Institution :
Dept. of Electron. & Commun. Eng., Peking Univ., Wuxi, China
fYear :
2015
fDate :
7-11 April 2015
Firstpage :
95
Lastpage :
98
Abstract :
This paper investigates a relatively new photoresist MR-I 7010R for its use in thermal nanoimprint lithography. The primary aspects tested were the thickness of the photoresist post imprinting and uniformity of the resulting residual layer thickness (RLT). These aspects were determined with respect to the initial thickness of the photoresist, which was deposited via spin-on coating, and change in pressure. Uniformity of the RLT is critical to the effectiveness of the resist´s use in thermal nanoimprint lithography as it determines the efficiency at which it can be etched. Imprinting with several conditions has been achieved with well acceptable residual layer to keep the stamp lifetime and efficiency of etching process.
Keywords :
etching; nanolithography; photoresists; soft lithography; spin coating; MR-I 7010R; RLT; etching process; photoresist post imprinting; residual layer thickness; spin-on coating; thermal nanoimprint lithography; thermoplastic properties; Nanolithography; Plasma temperature; Polymers; Resists; Temperature; Temperature measurement; Thickness measurement; lithography; nanofabrication; nanoimprint; nanomaterials; polymer; residual layer; uniformity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2015 IEEE 10th International Conference on
Conference_Location :
Xi´an
Type :
conf
DOI :
10.1109/NEMS.2015.7147382
Filename :
7147382
Link To Document :
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