DocumentCode :
718884
Title :
Electromolding for 3D cell culture
Author :
Yi-Han Lai ; Shih-Kang Fan
Author_Institution :
Nat. Taiwan Univ., Taipei, Taiwan
fYear :
2015
fDate :
7-11 April 2015
Firstpage :
268
Lastpage :
271
Abstract :
Constructing microstructures with crosslinkable biomaterials, gelatin methacrylate (GelMA) and poly(ethylene glycol) diacrylate (PEGDA), containing fibroblasts (NIH-3T3) are demonstrated using electromolding that combines electrowetting and dielectrophoresis on an electromicrofluidic platform without physical molds. Hydrogel prepolymer solutions with cells were dispensed and manipulated between two glass plates holding desired electrode patterns that determined the geometry of the 3D microstructures after crosslinking. The prepolymer hydrogel solution was driven and formed in the liquid state. After solidification, 3D structures containing particles and cells were adopted for cell culture. Prepolymer hydrogel solutions containing different particles or cells can be driven simultaneously for cell studies. The proposed electromolding is also applicable to various materials that are crosslinked differently by light, chemical reaction, or heat on a single platform.
Keywords :
bioMEMS; cellular biophysics; electrochemical electrodes; electrophoresis; gelatin; hydrogels; microfluidics; moulding; polymers; wetting; 3D cell culture; 3D microstructures; GelMA; NIH-3T3; PEGDA; chemical reaction; crosslinkable biomaterials; crosslinking; dielectrophoresis; electrode patterns; electromicrofluidic platform; electromolding; electrowetting; fibroblasts; gelatin methacrylate; glass plates; heat; hydrogel prepolymer solutions; light; liquid state; physical molds; poly(ethylene glycol) diacrylate; prepolymer hydrogel solutions; solidification; Dielectrophoresis; Electrodes; Fibroblasts; Fluorescence; Microstructure; Three-dimensional displays; 3D microstructure; electromolding; electrowetting; hydrogel;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2015 IEEE 10th International Conference on
Conference_Location :
Xi´an
Type :
conf
DOI :
10.1109/NEMS.2015.7147424
Filename :
7147424
Link To Document :
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