Title :
The effect of micro-spring stiffness changes on the typical MEMS S&A device
Author :
Wang Dakui ; Lou Wenzhong ; Xiong Yongjia ; Wang Fufu ; Liu Fangyi ; Jin Xin ; Lu Jun
Author_Institution :
State Key Lab. of Mechatron. Eng. & Control, Beijing Inst. of Technol., Beijing, China
Abstract :
The purpose of this paper is to study the remove insurance time with different stiffness of typical MEMS S&A (Safety and Arming)device, which are composed of the micro spring, slider, zigzag slot and card lock. According to higher dynamics theory, the zigzag slot collision energy loss, card lock closure features such as abstract the slider in the theoretical model of motion process, we used MATLAB to work out the displacement-time relationship of slider, and get the theoretical remove insurance time; Then we used ANSYS LS/DYNA finite element analysis of the structure, obtained the simulation process of slider displacement-time relationship, and got the numerical remove insurance time. By comparing theoretical analysis and simulation analysis, we can get the MEMS S&A device´s remove insurance time variation with spring stiffness, and verify the correctness of the simulation analysis, which provide a theoretical basis for the design of the type MEMS S&A device.
Keywords :
design engineering; elasticity; finite element analysis; micromechanical devices; springs (mechanical); ANSYS LS-DYNA finite element analysis; MATLAB; MEMS S&A device; card lock closure features; displacement-time relationship; higher dynamics theory; insurance time; microspring stiffness changes; numerical remove insurance time; safety and arming; slider displacement-time relationship; zigzag slot collision energy loss; Analytical models; Insurance; Latches; Mathematical model; Micromechanical devices; Numerical models; Springs; MEMS S&A device; simulation; stiffness; theory;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2015 IEEE 10th International Conference on
Conference_Location :
Xi´an
DOI :
10.1109/NEMS.2015.7147456
