DocumentCode
718910
Title
Failure of a MEMS switch after environmental test
Author
Ding Xuran ; Feng Yue ; Lou Wenzhong ; Guo Yunlong
Author_Institution
Nat. Key Lab. of Electro-Mech. Eng. & Control, Beijing Inst. of Technol., Beijing, China
fYear
2015
fDate
7-11 April 2015
Firstpage
417
Lastpage
420
Abstract
A MEMS switch based on electro-thermal and electro-explosion has been packaged before its humidity test, temperature shock test and ballistic shock test are taken. Some devices failed after the tests. The analysis of such a device is given in this paper.
Keywords
failure analysis; microswitches; semiconductor device reliability; semiconductor device testing; MEMS switch failure; ballistic shock test; electroexplosion; electrothermal; environmental test; humidity test; temperature shock test; Atmosphere; Electric shock; Humidity; Micromechanical devices; Microswitches; Resistance; MEMS switch; environmental test; failure;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems (NEMS), 2015 IEEE 10th International Conference on
Conference_Location
Xi´an
Type
conf
DOI
10.1109/NEMS.2015.7147457
Filename
7147457
Link To Document