A method to evaluate the influence of different substrate on stress mismatch induced deformation in MEMS accelerometer

Author

Jun You ; Dayu Tian ; Chunhua He ; Qiancheng Zhao ; Zhenchuan Yang ; Dacheng Zhang ; Guizhen Yan

Author_Institution

Shenzhen Grad. Sch., Peking Univ., Beijing, China

fYear

2015

fDate

7-11 April 2015

Firstpage

421

Lastpage

425

Abstract

This paper presents a method to evaluate the influence of stress mismatch between sensor structure and different die-attachment on the thermal stability of accelerometers. The local deformation of MEMS accelerometers under different thermal load and differential die-attachment conditions are investigated. White light interferometer and a home-made heating stage are used to carry out the measurement. Capacitance variations of differential capacitors can be calculated based on the data of the local deformation of MEMS accelerometers. Both the visual evidences and calculated capacitance variations in this work can give clear guidance to optimize both the structural design and packaging conditions.

Keywords

accelerometers; electronics packaging; light interferometers; microsensors; thermal stability; thermal stresses; MEMS accelerometer; capacitance variations; differential capacitors; differential die-attachment conditions; home-made heating stage; sensor structure; stress mismatch; thermal load; thermal stability; white light interferometer; Accelerometers; Capacitance; Capacitors; Ceramics; Loading; Substrates; Thermal loading; capacitance variation; deformation; packaging; structural design; temperature drift; thermal reliability;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems (NEMS), 2015 IEEE 10th International Conference on

Conference_Location

Xi´an

Type

conf

DOI

10.1109/NEMS.2015.7147458

Filename

7147458