• DocumentCode
    719539
  • Title

    Integration and Electrical Evaluation of Epitaxially Grown Si and SiGe Channels for Vertical NAND Memory Applications

  • Author

    Capogreco, Elena ; Degraeve, Robin ; Lisoni, Judit Gloria ; Luong, Vu ; Arreghini, Antonio ; Toledano-Luque, Maria ; Hikavyy, Andriy ; Numata, Toshinori ; De Meyer, Kristin ; Van den bosch, Geert ; Van Houdt, Jan

  • Author_Institution
    Imec, Leuven, Belgium
  • fYear
    2015
  • fDate
    17-20 May 2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Epitaxially grown Si and Si0.6Ge0.4 are integrated as replacement of poly-Si channel in vertical cylindrical transistors for vertical NAND memory application, in order to investigate the impact of the grain boundaries on current conduction. Epi-Si outperforms both poly-Si and Epi-SiGe channels, resulting in the best conduction, with large improvement on both sub threshold swing and transconductance (gm). The experimentally observed gm bimodal distribution for epi Si is corroborated and explained through a resistive network model: lower gm conduction occurs when current needs to cross a high resistance boundary, whereas higher gm is obtained when this boundary is not present.
  • Keywords
    Ge-Si alloys; NAND circuits; elemental semiconductors; epitaxial growth; grain boundaries; semiconductor growth; silicon; storage management chips; Si; Si0.6Ge0.4; current conduction; electrical evaluation; epitaxial growth; grain boundaries; high resistance boundary; lower gm conduction; observed gm bimodal distribution; polycrystalline silicon channel; resistive network model; subthreshold swing; transconductance; vertical NAND memory; vertical cylindrical transistors; Epitaxial growth; Flash memories; Grain boundaries; Junctions; Logic gates; Silicon; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Memory Workshop (IMW), 2015 IEEE International
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    978-1-4673-6931-2
  • Type

    conf

  • DOI
    10.1109/IMW.2015.7150291
  • Filename
    7150291