DocumentCode :
719549
Title :
Single-Poly Embedded NVM Solution for Analog Trimming and Code Storage Applications
Author :
Sung-Kun Park ; Kwang-Il Choi ; Nam-Yoon Kim ; Jung-Hoon Kim ; Young-Jun Kwon ; Kwang-Sik Ko ; In-Wook Cho ; Kyung-Dong Yoo
Author_Institution :
SK hynix Inc., Cheongju, South Korea
fYear :
2015
fDate :
17-20 May 2015
Firstpage :
1
Lastpage :
4
Abstract :
We report a single-poly embedded nonvolatile memory (eNVM) solution for analog trimming and code storage applications using a 0.13-μm BCDMOS process. Each cell has its own merits and demerits, depending on structure and operation methods. For analog trimming purposes, a conventional n-well coupling Fowler-Nordheim tunneling cell with a large unit cell size of 88 μm2 is used. On the other hand, a select gate lateral coupling (SGLC) cell for code storage purposes has a much smaller unit cell size of 2.82 μm2, which is comparable to the size of SRAM. The SGLC cell is fabricated using a combination of only 1.5-V and 5-V transistor-related processes for channel hot electron injection programming. The SGLC cell exhibits a high programming speed of 100 μs and is over-erase-free, which is suitable for a NOR array structure. In addition, both cells also had a retention lifetime of more than 10 years. Thus, these cells can be fabricated to match the requirements of various eNVM applications.
Keywords :
BIMOS integrated circuits; SRAM chips; embedded systems; hot carriers; tunnelling; BCDMOS process; NOR array structure; SGLC; SRAM; analog trimming; channel hot electron injection programming; code storage; eNVM solution; gate lateral coupling cell; large unit cell size; n-well coupling Fowler-Nordheim tunneling cell; nonvolatile memory; retention lifetime; single-poly embedded NVM solution; size 0.13 mum; time 100 mus; transistor-related processes; voltage 1.5 V; voltage 5 V; Couplings; Degradation; Hot carriers; Junctions; Logic gates; Nonvolatile memory; Programming;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Memory Workshop (IMW), 2015 IEEE International
Conference_Location :
Monterey, CA
Print_ISBN :
978-1-4673-6931-2
Type :
conf
DOI :
10.1109/IMW.2015.7150304
Filename :
7150304
Link To Document :
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